Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing
نویسندگان
چکیده
The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations.
منابع مشابه
1 Fully solution - processable fabrication of 2 multi - layered circuits on flexible substrate using laser 3
1 Department of Nano Mechanics, Nanomechanical Systems Research Division, Korea Institute of Machinery 6 and Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of Korea 7 2 Department of Nano-Mechatronics, Korea University of Science and Technology (UST), 217 Gajeong-Ro, 8 Yuseong-Gu, Daejeon 34113, Republic of Korea 9 3 Department of Laser & Electron Beam Application, KIMM, Kore...
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